HP BladeSystem Cooling White Paper

Hewlett-Packard Corporation has introduced a line of blade server products with a radically redesigned power and cooling system. According to HP advertising, the “HP Thermal Logic”power and cooling system represents a new approach that significantly reduces the power consumption and required airflow for data centers requiring fully-featured, high-density servers.

This paper presents a laboratory study comparing “HP Thermal Logic” blade server power and cooling design versus a competitive blade platform as well as two traditional 1U rack servers, and evaluates the power consumption and cooling performance of each system under a workload that simulates a light and heavily-utilized data center.

PDF icon SNA-Blade-Power-Cooling.pdf270.47 KB